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MURS210AG Datasheet PDF - Shenzhen Foster Semiconductor Co., Ltd.

Part Name
Description
MFG CO.
MURS210AG
FOSTER
Shenzhen Foster Semiconductor Co., Ltd. FOSTER
Other PDF
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PDF
MURS210AG Datasheet PDF : PDF DOWNLOAD     
MURS210AG image

Features
• Batch process design, excellent power dissipation offers
   better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
   optimize board space.
• High current capability.
• Superfast recovery time for switching mode application.
• High surge current capability.
• Glass passivated chip junction.
• Lead-free parts meet RoHS requirments.

Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, JEDEC DO-214AC / SMA
• Terminals : Solder plated, solderable per
                     MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : 0.07 gram

 

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